Thermal Management Handbook: For Electronic Assemblies
Type
Book
Authors
ISBN 10
0070266999
ISBN 13
9780070266995
Category
REFERENCE
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Publication Year
1998
Publisher
Pages
650
Description
In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges ― and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage ― and preventing thermal-related problems from occurring in the first place. - from Amzon
Number of Copies
1
