Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

Type
Book
Authors
George Harman
 
ISBN 10
0930815254 
ISBN 13
9780930815257 
Category
REFERENCE  [ Browse Items ]
Publication Year
1989 
Publisher
Intl Society of Hybrid 
Pages
202 
Tags
Microelectronics, Technology, New, Used & Rental Textbooks 
Description
Hardcover Book - Wire Bonding in Microelectronics
ISBN # 0-930815-25-4 - from Amzon 
Number of Copies
1 
Accession‎ No Call No Availability
10399 TK 7874.H387 1989   Yes

RELATED ITEMS

REVIEWS (0) -

No reviews posted yet.

WRITE A REVIEW

Please login to write a review.
Login Sign Up