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Page 9 of 109

  Title Copies
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science 
Edition: First Edition 
Year: 1989 
ISBN: 0930815254 
ISBN 13: 9780930815257 
 1 
Electronic Devices and Circuits 
Edition: 2nd 
Year: 1980 
ISBN: 0835916340 
ISBN 13: 9780835916349 
Call No: TK 7871.85 B3785 
 1 
Protecting Electronic Equipment from Electrostatic Discharge 
Year: 1985 
ISBN: 0830618201 
ISBN 13: 9780830618200 
Call No: TK 7870.L23 1984 
 1 
Proceedings of the Technical Program: 5th Annual International Electronics Packaging Conference, October 21, 22, 23, 1985 Orlando, Florida 
Year: 1985 
Call No: TK 7870.I55 1985 
 1 
Proceedings of the Technical Program: 6th Annual International Electronics Packaging Conference, November 17, 18, 19, 1986 San Diego, California 
Year: 1986 
Call No: TK 7870.I55 1986 
 1 
Proceedings of the Technical Conference: 7th Annual International Electronics Packaging Conference, Boston, Massachusetts (Two Volume Set) 
Year: 1987 
Call No: TK 7870.I55 1987 
 2 
Proceedings of the Technical Conference: 1990 International Electronics Packaging Conference, Marlborough, Massachusetts, September 10-12, 1990 
Year: 1990 
Call No: TK 7870.I55 1990 
 1 
Proceedings of the Technical Conference: 1991 International Electronics Packaging Conference, San Diego, California, September 15-18, 1991 (Two Volume Set) 
Year: 1991 
Call No: TK 7870.I55 1991 
 2 
Proceedings of the Technical Conference: 1992 International Electronics Packaging Conference, Austin, Texas, September 27-30, 1992 (Two Volume Set) 
Year: 1992 
Call No: TK 7870.I55 1992 
 2 
Proceedings of the Technical Conference: 1993 International Electronics Packaging Conference, San Diego, California, September 27-30 1992 (Two Volume Set) 
Year: 1993 
Call No: TK 7870.I55 1993 
 2 
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